Bulg. J. Phys. vol.16 no.2 (1989), pp. 232-238
Influence of High Temperature Annealing on Structure and Resistivity of Amorphous and Polycrystalline Silicon Layers
T.K. Merodiiska, E.A. Goranova, Z.I. Alexieva, T.R. Stoyanchov
Institute of Microelectronics, Sofia 1184
go backInstitute of Microelectronics, Sofia 1184
Abstract. Amorphous and polycrystalline silicon layers are deposited in a LPCVD system at 570? and over 600?C, respectively, and are submitted to a high temperature treatment in N2 or O2. The surface morphology and layer structure after deposition and high temperature annealing have been investigated by TEM, UV reflectance and electron diffraction. Annealed and unannealed layers have been doped by POCl3 predeposilion. It has been established that layers deposited as amorphous are with significantly lower resistivity than those deposited as polycrystalline, regardless of the preliminary annealing.

